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| Hall IC Series Bipolar Latch Hall IC BU52040HFV No.10045EBT05 Description BU52040 Hall Effect IC for wheel keys / trackballs is designed to detect a switch in magnetic field from N to S (or vice versa) and maintain its detection result on the output until the next switch. Output is pulled low for S-pole fields and high for N-pole fields. This IC is ideal for detecting the number of shaft rotations inside of a wheel key, trackball, or other similar applications. Using two ICs can also enable detection of rotation direction. Features 1) Ideally suited for wheel keys or trackballs 2) Micropower operation (small current consumption via intermittent operation method) 3) Ultra-small outline package 4) Supports 1.8 V supply voltage 5) High ESD resistance: 8kV (HBM) Applications Wheel keys (zero-contact selection dials), trackballs, and other interface applications. Product Lineup Product name BU52040HFV Supply voltage (V) 1.653.30 Operation point Hysteresis (mT) (mT) +/-3.0 6.0 Period (s) 500 Supply current (AVG) (A) 200 Output type CMOS Package HVSOF5 Plus is expressed on the S-pole; minus on the N-pole Absolute Maximum Ratings BU52040HFV (Ta = 25C) Parameters Power Supply Voltage Output Current Power dissipation Operating Temperature Range Storage Temperature Range Symbol VDD IOUT Pd Topr Tstg Limit -0.14.5 0.5 5362 -40+85 -40+125 1 Unit V mA mW C C 1. Not to exceed Pd 2. Reduced by 5.36mW for each increase in Ta of 1 over 25(mounted on 70mmx70 mmx1.6mm Glass-epoxy PCB) www.rohm.com (c) 2010 ROHM Co., Ltd. All rights reserved. 1/12 2010.01 - Rev.B BU52040HFV Magnetic, Electrical Characteristics BU52040HFV (Unless otherwise specified, VDD=1.80V, Ta=25C) Limit Parameters Symbol Min Typ Power Supply Voltage Operation point Release Point Hysteresis Period Output High Volage Output Low Voltage Supply Current 1 Supply Current During Startup Time 1 Supply Current During Standby Time 1 Supply Current 2 Supply Current During Startup Time 2 Supply Current During Standby Time 2 VDD Bop Brp Bhys Tp VOH VOL IDD1(AVG) IDD1(EN) IDD1(DIS) IDD2(AVG) IDD2(EN) IDD2(DIS) 1.65 1.0 -5.0 VDD - 0.2 1.80 3.0 -3.0 6.0 500 200 3.0 2.0 300 4.5 3.5 Technical Note Max 3.30 5.0 -1.0 1200 0.2 300 450 - Unit V mT mT mT s V V A mA A A mA A Conditions B < Brp3 IOUT =-0.5mA Bop < B IOUT =+0.5mA VDD =1.8V, Average VDD =1.8V, During Startup Time Value VDD =1.8V, During Standby Time Value VDD=2.7V, Average VDD=2.7V, During Startup Time Value VDD=2.7V, During Standby Time Value 3 3. B = Magnetic flux density 1mT=10Gauss Positive ("+") polarity flux is defined as the magnetic flux from south pole which is direct toward to the branded face of the sensor. After applying power supply, it takes one cycle of period (TP) to become definite output. Radiation hardiness is not designed. www.rohm.com (c) 2010 ROHM Co., Ltd. All rights reserved. 2/12 2010.01 - Rev.B BU52040HFV Figure of measurement circuit Bop/Brp Tp 200 Technical Note VDD VDD 100F GND OUT V VDD VDD Oscilloscope GND OUT Bop and Brp are measured with applying the magnetic field from the outside. The period is monitored by Oscilloscope. Fig.1 Bop,Brp measurement circuit Fig.2 Tp measurement circuit VOH VDD VDD 100F GND OUT V IOUT0.5mA Fig.3 VOH measurement circuit VOL VDD VDD 100F GND OUT V IOUT0.5mA Fig.4 VOL measurement circuit IDD A VDD OUT GND VDD 2200F Fig.5 IDD measurement circuit www.rohm.com (c) 2010 ROHM Co., Ltd. All rights reserved. 3/12 2010.01 - Rev.B BU52040HFV Reference Data 8.0 MAGNETIC FLUX DENSITY [mT] 6.0 4.0 2.0 0.0 -2.0 -4.0 -6.0 -8.0 -60 -40 -20 0 20 40 60 80 100 8.0 MAGNETIC FLUX DENSITY [mT] 800 Technical Note VDD=1.8V 6.0 4.0 2.0 0.0 -2.0 -4.0 -6.0 -8.0 1.4 Bop Ta = 25C Bop PERIOD [ s] 700 600 500 400 300 200 VDD=1.8V Brp Brp 1.8 2.2 2.6 3.0 3.4 3.8 -60 -40 -20 0 20 40 60 80 100 AMBIENT TEMPERATURE [] SUPPLY VOLTAGE V AMBIENT TEMPERATURE [] Fig.6 Bop,Brp- Ambient temperature Fig.7 Bop,Brp- Supply voltage Fig.8 TP- Ambient temperature AVERAGE SUPPLY CURRENT [A] AVERAGE SUPPLY CURRENT [A] 800 700 PERIOD [s] 400 350 300 250 200 150 100 -60 -40 -20 0 20 40 60 80 100 AMBIENT TEMPERATURE [] VDD=1.8V 400 350 300 250 200 150 100 1.4 1.8 2.2 2.6 3.0 3.4 3.8 SUPPLY VOLTAGE [V] Ta = 25C Ta = 25C 600 500 400 300 200 1.4 1.8 2.2 2.6 3.0 3.4 3.8 SUPPLY VOLT AGE [V] Fig.9 TP- Supply voltage Block Diagram BU52040HFV DD Fig.10 IDD- Ambient temperature Fig.11 IDD - Supply voltage 0.1 F 4 TIMING LOGIC DYNAMIC OFFSET CANCELLATION HALL ELEMENT Adjust the bypass capacitor value as necessary, according to voltage noise conditions, etc. SAMPLE & HOLD x 5 OUT The CMOS output terminals enable direct connection to the PC, with no external pull-up resistor required. LATCH 2 GND Fig.12 PIN No. 1 2 3 4 5 PIN NAME N.C. GND N.C. VDD OUT POWER SUPPLY OUTPUT GROUND OPEN or Short to GND. FUNCTION COMMENT OPEN or Short to GND. 5 4 4 5 1 2 3 3 Surface 2 1 Reverse www.rohm.com (c) 2010 ROHM Co., Ltd. All rights reserved. 4/12 2010.01 - Rev.B BU52040HFV Technical Note Description of Operations (Micro-power Operation) The Hall Effect IC for wheel keys / trackballs adopts an intermittent operation method to save energy. At startup, the Hall elements, amp, comparator and other detection circuits power ON and magnetic detection begins. During standby, the detection circuits power OFF, thereby reducing current consumption. The detection results are held while standby is active, and then output. Reference period: 500 s (MAX. 1200 s) Reference startup time: 24 s IDD Period Startup time Standby t Fig.13 (Offset Cancellation) The Hall elements form an equivalent Wheatstone (resistor) bridge circuit. Offset voltage may be generated by a differential in this bridge resistance, or can arise from changes in resistance due to package or bonding stress. A dynamic offset cancellation circuit is employed to cancel this offset voltage. When Hall elements are connected as shown in Fig. 14 and a magnetic field is applied perpendicularly to the Hall elements, voltage is generated at the mid-point terminal of the bridge. This is known as the Hall voltage. Dynamic cancellation switches the wiring (shown in the figure) to redirect the current flow to a 90 angle from its original path, and thereby cancels the Hall voltage. The magnetic signal (only) is maintained in the sample/hold circuit during the offset cancellation process and then released. VDD I Bx Hall Voltage GND Fig.14 www.rohm.com (c) 2010 ROHM Co., Ltd. All rights reserved. 5/12 2010.01 - Rev.B BU52040HFV (Magnetic Field Detection Mechanism) OUT [V] Technical Note High Low Brp N-pole 0 B Bop S-pole Magnetic flux density [mT] Fig.15 The IC detects magnetic fields that running horizontal to the top layer of the package. When the magnetic pole switches from N to S, the output changes from high to low; likewise, when the magnetic pole switches from S to N, the output changes from low to high. The output condition is held unit the next switch in magnetic polarity is detected. [Operation in Continuously Changing Magnetic Fields] Direction of magnet movement S Magnet S N N S S N N S S N N Hall IC S Magnetic field N Bop Brp High Hall IC output Low Fig.16 The IC can detect a continuous switch in magnetic field (from N to S and S to N) as depicted above. www.rohm.com (c) 2010 ROHM Co., Ltd. All rights reserved. 6/12 2010.01 - Rev.B BU52040HFV Intermittent Operation at Power ON Technical Note VDD Supply current (Intermittent operation) Startup time Standby time Startup time Standby time OUT (N magnetic field present) Indefinite High (B (Bop Low Indefinite interval (Brp N S N S S N N S BU52040HFV: 2pcs Mounting Position of Hall IC Inside Wheel Key The angular separation of the two Hall ICs within the footprint of the wheel key depends on N/S division angle of the internal magnet (), and can be set to either /4 or 3/4. Mounting the two ICs in this position causes the magnetic phase difference between the ICs to equal 1/4, and the direction of rotation can be detected by measuring the change in this difference. An example of the magnetic field characteristics for this application is shown in the figure below. 1) Mounting angle of Hall IC = /4 /4 2) Mounting angle of Hall IC = 3/4 3/4 N/S division angle of circular magnet = Counterclockwise rotation N S N S Clockwise rotation S N S NSNS N Hall IC A Hall IC B Hall IC A Hall IC B S N SN Center of magnet Center of magnet Mounting Angle of Hall IC Circular Magnet www.rohm.com (c) 2010 ROHM Co., Ltd. All rights reserved. 7/12 2010.01 - Rev.B BU52040HFV Detection of Rotation Direction 1) Mounting angle = /4 Clockwise Rotation Magnetic field applied to IC A Magnetic field applied to IC B S N Bop rotation angle Technical Note Counterclockwise Rotation Magnetic field applied to IC A Magnetic field applied to IC B S N Bop rotation angle Brp Brp Hall IC A output High Hall IC A output High Low Hall IC B output Low Hall IC B output High High Low Low Clockwise turn: Output of IC B is low when output of IC A becomes high 2) Mounting angle = 3/4 Clockwise Rotation Magnetic field applied to IC A Magnetic field applied to IC B S N Bop rotation angle Counterclockwise turn: Output of IC B is high when output of IC A becomes high Counterclockwise Rotation Magnetic field applied to IC A Magnetic field applied to IC B S N Bop rotation angle Brp Brp Hall IC A output High Hall IC A output High Low Low Hall IC B output High Hall IC B output High Low Low Clockwise turn: Output of IC B is high when output of IC A becomes high. Counterclockwise turn: Output of IC B is a low when output of IC A becomes high. Because the IC measures changes in magnetic field every 1200 S, the IC cannot detect changes in rotation at speeds exceeding this period. www.rohm.com (c) 2010 ROHM Co., Ltd. All rights reserved. 8/12 2010.01 - Rev.B BU52040HFV Magnet Selection Horizontally Stacked Magnet Vertically Stacked Magnet Technical Note S S N N S S N N S S N Flux Flux Because the field loop in horizontally stacked magnets extends for a shorter distance than that of vertically stacked magnets, the gap between the magnet and the hall IC must be decreased. Therefore, if horizontally-stacked magnets are used in the application, the thickness of the magnet or the area of each section should be increased to allow for a larger gap between the magnet and IC. Because the IC is unable to detect rotation direction if using magnets that are smaller than the IC's package size, ensure that the physical size of each N/S division is larger than the IC's package, and that the ICs are properly mounted with an angular distance of either /4 or 3/4 from one another (where = N/S division angle of circular magnet). IC Reference Position Mounting angle of Hall IC Magnet N/S division angle = Hall IC (x2) Counterclockwise rotation N S N S S NS N S N S Clockwise rotation N SN S N Circular Magnet Position of the Hall Effect IC(Reference) HVSOF5 0.6 0.8 0.2 (UNITmm) www.rohm.com (c) 2010 ROHM Co., Ltd. All rights reserved. 9/12 2010.01 - Rev.B BU52040HFV Footprint dimensions (Optimize footprint dimensions to the board design and soldering condition) HVSOF5 Technical Note (UNITmm) Terminal Equivalent Circuit Diagram Because they are configured for CMOS (inverter) output, the output pins require no external resistance and allow direct connection to the PC. This, in turn, enables reduction of the current that would otherwise flow to the external resistor during magnetic field detection, and supports overall low current (micropower) operation. OUT VDD GND Fig.18 www.rohm.com (c) 2010 ROHM Co., Ltd. All rights reserved. 10/12 2010.01 - Rev.B BU52040HFV Technical Note Notes for use 1) Absolute maximum ratings Exceeding the absolute maximum ratings for supply voltage, operating conditions, etc. may result in damage to or destruction of the IC. Because the source (short mode or open mode) cannot be identified if the device is damaged in this way, it is important to take physical safety measures such as fusing when implementing any special mode that operates in excess of absolute rating limits. 2) GND voltage Make sure that the GND terminal potential is maintained at the minimum in any operating state, and is always kept lower than the potential of all other pins. 3) Thermal design Use a thermal design that allows for sufficient margin in light of the power dissipation (Pd) in actual operating conditions. 4) Pin shorts and mounting errors Use caution when positioning the IC for mounting on printed circuit boards. Mounting errors, such as improper positioning or orientation, may damage or destroy the device. The IC may also be damaged or destroyed if output pins are shorted together, or if shorts occur between the output pin and supply pin or GND. 5) Positioning components in proximity to the Hall IC and magnet Positioning magnetic components in close proximity to the Hall IC or magnet may alter the magnetic field, and therefore the magnetic detection operation. Thus, placing magnetic components near the Hall IC and magnet should be avoided in the design if possible. However, where there is no alternative to employing such a design, be sure to thoroughly test and evaluate performance with the magnetic component(s) in place to verify normal operation before implementing the design. 6) Operation in strong electromagnetic fields Exercise extreme caution about using the device in the presence of a strong electromagnetic field, as such use may cause the IC to malfunction. 7) Common impedance Make sure that the power supply and GND wiring limits common impedance to the extent possible by, for example, employing short, thick supply and ground lines. Also, take measures to minimize ripple such as using an inductor or capacitor. 8) GND wiring pattern When both a small-signal GND and high-current GND are provided, single-point grounding at the reference point of the set PCB is recommended, in order to separate the small-signal and high-current patterns, and to ensure that voltage changes due to the wiring resistance and high current do not cause any voltage fluctuation in the small-signal GND. In the same way, care must also be taken to avoid wiring pattern fluctuations in the GND wiring pattern of external components. 9) Power source design Since the IC performs intermittent operation, it has peak current when it's ON. Please taking that into account and under examine adequate evaluations when designing the power source. www.rohm.com (c) 2010 ROHM Co., Ltd. All rights reserved. 11/12 2010.01 - Rev.B BU52040HFV Ordering part number Technical Note B Part No U 5 Part No 52040 2 0 4 0 H F V - T R Package HFV : HVSOF5 Packaging and forming specification TR: Embossed tape and reel (HVSOF5) HVSOF5 1.60.05 (0.8) 0.2MAX Tape Quantity Direction of feed Embossed carrier tape 3000pcs TR The direction is the 1pin of product is at the upper right when you hold 1.20.05 (MAX 1.28 include BURR) 1.00.05 (0.05) (0.3) 1.60.05 5 4 4 5 (0.91) (0.41) ( reel on the left hand and you pull out the tape on the right hand 1pin ) 123 321 0.130.05 S 0.6MAX +0.03 0.02 -0.02 0.1 0.5 0.220.05 S 0.08 M Direction of feed (Unit : mm) Reel Order quantity needs to be multiple of the minimum quantity. www.rohm.com (c) 2010 ROHM Co., Ltd. All rights reserved. 12/12 2010.01 - Rev.B Notice Notes No copying or reproduction of this document, in part or in whole, is permitted without the consent of ROHM Co.,Ltd. The content specified herein is subject to change for improvement without notice. The content specified herein is for the purpose of introducing ROHM's products (hereinafter "Products"). If you wish to use any such Product, please be sure to refer to the specifications, which can be obtained from ROHM upon request. Examples of application circuits, circuit constants and any other information contained herein illustrate the standard usage and operations of the Products. The peripheral conditions must be taken into account when designing circuits for mass production. Great care was taken in ensuring the accuracy of the information specified in this document. However, should you incur any damage arising from any inaccuracy or misprint of such information, ROHM shall bear no responsibility for such damage. The technical information specified herein is intended only to show the typical functions of and examples of application circuits for the Products. ROHM does not grant you, explicitly or implicitly, any license to use or exercise intellectual property or other rights held by ROHM and other parties. ROHM shall bear no responsibility whatsoever for any dispute arising from the use of such technical information. The Products specified in this document are intended to be used with general-use electronic equipment or devices (such as audio visual equipment, office-automation equipment, communication devices, electronic appliances and amusement devices). The Products specified in this document are not designed to be radiation tolerant. While ROHM always makes efforts to enhance the quality and reliability of its Products, a Product may fail or malfunction for a variety of reasons. Please be sure to implement in your equipment using the Products safety measures to guard against the possibility of physical injury, fire or any other damage caused in the event of the failure of any Product, such as derating, redundancy, fire control and fail-safe designs. ROHM shall bear no responsibility whatsoever for your use of any Product outside of the prescribed scope or not in accordance with the instruction manual. The Products are not designed or manufactured to be used with any equipment, device or system which requires an extremely high level of reliability the failure or malfunction of which may result in a direct threat to human life or create a risk of human injury (such as a medical instrument, transportation equipment, aerospace machinery, nuclear-reactor controller, fuelcontroller or other safety device). ROHM shall bear no responsibility in any way for use of any of the Products for the above special purposes. If a Product is intended to be used for any such special purpose, please contact a ROHM sales representative before purchasing. If you intend to export or ship overseas any Product or technology specified herein that may be controlled under the Foreign Exchange and the Foreign Trade Law, you will be required to obtain a license or permit under the Law. Thank you for your accessing to ROHM product informations. More detail product informations and catalogs are available, please contact us. ROHM Customer Support System http://www.rohm.com/contact/ www.rohm.com (c) 2010 ROHM Co., Ltd. All rights reserved. R1010A |
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